TSMC Leads, but Samsung Aims to Close the 2nm Gap

Samsung is working hard to close the gap with TSMC in the global semiconductor market as both companies prepare for the 2nm era. While Samsung has faced challenges with its 3nm technology, the 2nm process could be a turning point.

According to Chosun, Samsung is seeking deals with OEMs for its 2nm process to compete with TSMC. The company’s recent struggles allowed TSMC to expand its lead, but Samsung aims to regain ground by improving its production ecosystem.

Samsung plans to begin mass production of 2nm chips in the second half of 2025, alongside TSMC. Unlike the 3nm process, the 2nm node introduces significant advancements in performance and efficiency.

Samsung is collaborating with design houses and building partnerships in areas like electronic design automation (EDA) and chip testing to strengthen its position.

The competition is fierce, with TSMC achieving a reported 60% yield in its 2nm pilot production. TSMC also plans to produce 2nm chips at its Arizona plant, further expanding its global footprint.

Samsung, however, has made progress. Reports indicate that its 2nm process has exceeded initial yield expectations. The company has already secured two orders for 2nm-based AI accelerators, one from Japan’s Preferred Networks and another from a Korean NPU manufacturer.

A source familiar with Samsung’s operations stated that advanced process yields depend on both manufacturing technology and design synergy.

While Samsung faced criticism earlier this year, its recent improvements suggest it could challenge TSMC in the 2nm era. The race is on, and the next few years will determine whether Samsung can outpace its rival.