Sony has revealed improvements to the cooling system of the PS5 Pro, particularly focusing on its liquid metal cooling technology. These updates aim to make the cooling process more stable and address earlier concerns about liquid metal leaking in the standard PS5.
The new PS5 Pro features fine grooves where the liquid metal is applied, which help ensure that the cooling effect remains stable over time. This update comes after earlier claims, though unproven, that liquid metal in the PS5 could leak and cause damage to the console.
Sony’s team, led by Shinya Tsuchida, the PS5 Pro’s mechanical design lead, emphasized that this redesign makes the cooling system more reliable.
While the structure of the cooling system remains similar to the original PS5, the addition of grooves ensures a more efficient thermal management system. These changes are crucial as semiconductors in consoles become more powerful and dense, requiring more effective cooling methods.
Other improvements to the PS5 Pro include a larger fan with redesigned fan blades that enhance airflow. The motherboard also has extra electrical layers to speed up memory access, making the console’s performance even better.
Overall, Sony’s PS5 Pro brings significant upgrades in both cooling and performance, showing a continued commitment to enhancing the console’s technology.
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