Huawei’s latest AI chip, the Ascend 910B, demonstrates significant differences from its predecessor, highlighting the company’s innovative approach to chip development under international technology restrictions.
Die shots reveal a fascinating story of technological adaptation and domestic manufacturing capabilities.
The new Ascend 910B, reportedly produced by Chinese manufacturer SMIC, shows a markedly different design compared to the original TSMC-produced chip.
While the original Ascend 910 featured 32 DaVinci Max AI cores, the 910B contains 25 potentially new “DaVinci” cores. The chip’s die size has increased substantially, measuring 665.61 mm², compared to the original’s 456.25 mm².
This change likely reflects the challenges Huawei faces in maintaining advanced chip production after being cut off from international semiconductor supply chains. The larger die size could result from SMIC’s less advanced manufacturing process, which may have lower transistor density compared to TSMC’s more sophisticated technology.
The development also includes an intriguing Ascend 610 chip, which combines general-purpose CPU cores with AI-specific cores, suggesting Huawei is exploring versatile computing solutions for edge devices.
While officially unconfirmed, this chip represents another step in Huawei’s efforts to develop domestic semiconductor technology.
These chips demonstrate Huawei’s resilience and technological innovation in the face of international trade restrictions, showcasing the company’s ability to adapt and develop alternative technological solutions.
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