Apple to Push Back 2nm Chip Release by a Year Due to TSMC Yield Issues

Apple’s plans to launch the iPhone 17 Pro with a 2nm chip in 2025 have been delayed by a year, according to reports from South Korea.

The delay is due to TSMC’s difficulties with wafer yield. The Taiwanese company, which exclusively produces chips for Apple devices, has not yet achieved the necessary standards for mass production of the 2nm chips.

Insiders reveal that TSMC is struggling to meet the demand for test products and is working to adapt its existing facilities for the new 2nm process. This will take more time than expected.

Currently, the yield for 2nm wafers stands at just 60%, meaning 40% of each wafer is unusable. With production costs at around $30,000 per wafer, TSMC is losing $120 million every month due to these imperfections.

To avoid delays, Apple will continue using the 3nm process for another year. This will allow TSMC to improve the yield and pricing of the 2nm chips.

TSMC has plans to expand its production capacity, with its Arizona facility expected to help meet a total capacity of 140,000 wafers per month by 2026.

While TSMC is the main supplier for Apple, it also serves other clients like Nvidia and Qualcomm.

These companies are reportedly in talks with Samsung Electronics to explore production options in South Korea, in case tensions in Taiwan continue to rise.