Huawei may soon become the first smartphone brand to launch a device powered by HBM (High-Bandwidth Memory), a major upgrade over today’s LPDDR5X RAM. According to recent leaks, Huawei could beat Apple and other tech giants in bringing this next-gen memory technology to mobile devices.
HBM is currently used in top-tier AI chips from companies like Nvidia and AMD, known for delivering extremely high performance. This memory is now expected to appear in smartphones, where AI workloads are growing fast.
Most smartphones today use LPDDR5X, which offers speeds up to 68GB/s. But HBM—or a new version known as LLW (Low-Latency Wide I/O) DRAM—can push performance up to 128GB/s, making it much more suitable for powerful on-device AI processing.
Well-known leaker Fixed Focus Digital suggests that the first smartphones with this advanced memory won’t use full-scale HBM like in GPUs, but rather a mobile-optimized version like LLW DRAM. Even so, it will be a big step forward for AI-focused smartphones.
While many expect Apple to lead with new memory tech in its iPhones, reports suggest that Huawei might be the first to release an HBM-powered smartphone. Samsung, which manufactures both HBM and mobile devices, is also in a strong position to join the race.
If true, this would mark a major leap in smartphone hardware, bringing AI-focused memory tech once reserved for PCs and servers into the palm of your hand.
